About Us
BHOSCH Electronics Applied Technology (BEAT) has established state-of-the-art facilities for the manufacturing of ceramic substrate PCBs and a wide range of electronic packaging solutions.
We support low-, medium-, and high-volume production of ceramic PCBs, die assembly, wire bonding, metal packaging, and epoxy encapsulation. Custom ceramic PCBs and package designs can be developed to meet specific customer requirements.
BEAT is founded and managed by industry experts in electronic packaging with over 30 years of experience.
BHOSCH Electronics Applied Technology (BEAT) has setup state of art manufacturing facilities with :
RCC Building of 20,000 sq. ft.
Full plant having Centralised air-conditioning
Reliable and clean power sources to support sensitive and high-demand equipment, provided through UPS and genset backup
Water purification systems installed for the production of ultra-pure water used in various processes
Supply of gases like nitrogen, argon, and compressed air for processes and environmental control provided through well-structured lines
Facilities and Equipment at BHOSCH Electronics Applied Technology (BEAT)
| CAD Centre for Design | Ultra-low Vacuum Ovens |
| Laser photo plotter | Vacuum Brazing Furnaces |
| SS Mesh Stretcher | High Temperature Sintering Furnace |
| Screen Exposer | VMC and CNC Machines |
| Stencil and Screen Printer | Mechanical Presses |
| Laser CNC Routing and Drilling | Sand Blasting Machine |
| Laser Marking | Surface Plates |
| Precise Screen and Stencil Printer | Powder Compacting Press |
| Curing Ovens | Electro Cleaning Path |
| High Temperature Belt Furnaces | Nickel Plating |
| Resistor Laser Trimming | Gold Plating |
| Magnetron Sputtering Machines | Copper Plating |
| Spin Coaters | Auto Die Bonder |
| Mask Aligner | Auto Wire Bonder |
| Plasma Cleaning Machine | Auto Bond Pull Tester |
| Chemical and Dry Etching Systems | Semi auto Wire Bonders |
| Ultrasonic Cleaning Machines | Laser Welding Machines |
| XRF Analyser | Helium Leak Detector |