Our Products
Ceramic Substrates & Hermetic Packages Manufacturer in Pune
Our Product Range – Ceramic Substrates, Hermetic Packages & Testing Jigs
BHOSCH Electronics Applied Technology (BEAT) manufactures a comprehensive range of electronic packaging and substrate solutions, including Thick & Thin Film Ceramic Substrates, DBC and LTCC Substrates, Hermetic Metal Packages, Microelectronics Assembly, and Functional Testing Jigs — engineered for high-reliability applications in defense, aerospace, and industrial electronics.
