The advantages of DBC substrates are high current-carrying capability due to thick copper metallization and a thermal expansion close to silicon at the copper surface due to the high bond strength of copper to ceramic. DBC substrates have an excellent performance-to-cost efficiency ratio. The great heat conductivity of Al₂O₃ (24 W/mK), as well as the high heat capacity, make it a classic and irreplaceable material in power electronics. The thick copper foils offer extremely good electrical and thermal conductivity and form an outstanding base for soldering and wire bonding processes.
The advantages of DBC substrates are high current carrying capability due to thick copper Metallization and a thermal expansion close to the silicon at the copper surface due to high bond strength of copper to ceramic substrates have an excellent performance/cost efficiency ratio. The great heat conductivity of Al2O3 (24 W/mK) as well as the high heat capacity make it classic irreplaceable in power electronics. The thick copper foils offer extremely good electrical and thermal conductivity and form an outstanding base for the soldering and wire bonding processes.
