0204 to 2512 chip components, all SMD active devices, QFP 0.5mm pitch, BGA using automated placement machines.
Joining components to the substrate using high-temperature soldering techniques like SMT or through-hole soldering.
Attaching semiconductor dies onto the substrate using specialized epoxy with high precision.
Connecting tiny leads from the components to the circuit board using fine gold/aluminum wires.
Encapsulating the assembled circuit with a protective package, using hermetic sealing.